Loading (50 kb)...'
(continued) ......... 20.0 13.4
pH...................................... (\1\) (\1\)
------------------------------------------------------------------------
\1\ Within the range 7.5 to 10.0
(f) In addition to paragraphs (a) and (b) of this section, the following limitation shall apply for plants discharging less than 38,000 l (10,000 gal) per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 4.57
------------------------------------------------------------------------
(g) In addition to paragraphs (a), (c), (d), and (e) of this section, the following limitation shall apply for plants discharging 38,000 l (10,000 gal) or more per calendar day of electroplating process waterwater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 2.13
------------------------------------------------------------------------
(h) In addition to paragraphs (a), (b), (c), (d), (e), (f), and (g) of this section, the following shall apply: An existing source submitting a certification in lieu of monitoring pursuant to §413.03 of this regulation must implement the toxic organic management plan approved by the control authority.
(Secs. 301, 304, 306, 307, 308, and 501 of the Clean Water Act (the Federal Water Pollution Control Act Amendments of 1972, 33 U.S.C. 1251 et. seq., as amended by the Clean Water Act of 1977, Pub. L. 95–217))
[46 FR 9467, Jan. 28, 1981, as amended at 48 FR 32484, July 15, 1983; 48 FR 43681, Sept. 26, 1983]
Subpart F—Chemical Etching and Milling Subcategory
top
§ 413.60 Applicability: Description of the chemical etching and milling subcategory.
top
The provisions of this subpart apply to discharges of process wastewaters resulting from the chemical milling or etching of ferrous or nonferrous materials.
§ 413.61 Specialized definitions.
top
For the purpose of this subpart:
(a) The term sq m (“sq. ft.”) shall mean the area exposed to process chemicals expressed in square meters (square feet).
(b) The term operation shall mean any step in the chemical milling or etching processes in which metal is chemically or electrochemically removed from the work piece and which is followed by a rinse; this includes related metal cleaning operations which preceded chemical milling or etching, when each operation is followed by a rinse.
§§ 413.62-413.63 [Reserved]
top
§ 413.64 Pretreatment standards for existing sources.
top
Except as provided in 40 CFR 403.7 and 403.13, any existing source subject to this subpart which introduces pollutants into a publicly owned treatment works must comply with 40 CFR Part 403 and achieve the following pretreatment standards for existing sources (PSES):
(a) No User introducing wastewater pollutants into publicly owned treatment works under the provisions of this subpart shall augment the use of process wastewater or otherwise dilute the wastewater as a partial or total substitute for adequate treatment to achieve compliance with this standard.
(b) For a source discharging less than 38,000 liters (10,000 gal.) per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart F_Chemical Etching and Milling Facilities Discharging Less Than
38,000 Liters Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, A................................... 5.0 2.7
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
------------------------------------------------------------------------
(c) For plants discharging 38,000 liters (10,000 gal.) or more per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart F_Chemicals Etching and Milling Facilities Discharging 38,000
Liters or More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 1.9 1.0
Cu...................................... 4.5 2.7
Ni...................................... 4.1 2.6
Cr...................................... 7.0 4.0
Zn...................................... 4.2 2.6
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
Total metals............................ 10.5 6.8
------------------------------------------------------------------------
(d) Alternatively, the following mass-based standards are equivalent to and may apply in place of those limitations specified under paragraph (c) of this section upon prior agreement between a source subject to these standards and the publicly owned treatment works receiving such regulated wastes:
Subpart F_Chemical Etching and Milling Facilities Discharging 38,000
Liters or More Per Day PSES Limitations (mg/sq m-operation)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 74 39
Cu...................................... 176 105
Ni...................................... 160 100
Cr...................................... 273 156
Zn...................................... 164 102
Pb...................................... 23 16
Cd...................................... 47 29
Total metals............................ 410 267
------------------------------------------------------------------------
(e) For wastewater sources regulated under paragraph (c) of this section, the following optional control program may be elected by the source introducing treated process wastewater into a publicly owned treatment works with the concurrence of the control authority. These optional pollutant parameters are not eligible for allowance for removal achieved by the publicly owned treatment works under 40 CFR 403.7. In the absence of strong chelating agents, after reduction of hexavalent chromium wastes, and after neutralization using calcium oxide (or hydroxide) the following limitations shall apply:
Subpart F_Chemical Etching and Milling Facilities Discharging 38,000
Liters or More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 1.9 1.0
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
TSS..................................... 20.0 13.4
pH...................................... (\1\) (\1\)
------------------------------------------------------------------------
\1\ Within the range 7.5 to 10.0
(f) In addition to paragraphs (a) and (b) of this section, the following limitation shall apply for plants discharging less than 38,000 l (10,000 gal) per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 4.57
------------------------------------------------------------------------
(g) In addition to paragraphs (a), (c), (d), and (e) of this section, the following limitation shall apply for plants discharging 38,000 l (10,000 gal) or more per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 2.13
------------------------------------------------------------------------
(h) In addition to paragraphs (a), (b), (c), (d), (e), (f), and (g) of this section, the following shall apply: An existing source submitting a certification in lieu of monitoring pursuant to §413.03 of this regulation must implement the toxic organic management plan approved by the control authority.
(Secs. 301, 304, 306, 307, 308, and 501 of the Clean Water Act (the Federal Water Pollution Control Act Amendments of 1972, 33 U.S.C. 1251 et. seq., as amended by the Clean Water Act of 1977, Pub. L. 95–217))
[46 FR 9467, Jan. 28, 1981, as amended at 48 FR 32484, July 15, 1983; 48 FR 43681, Sept. 26, 1983]
Subpart G—Electroless Plating Subcategory
top
§ 413.70 Applicability: Description of the electroless plating subcategory.
top
The provisions of this subpart apply to discharges resulting from the electroless plating of a metallic layer on a metallic or nonmetallic substrate.
§ 413.71 Specialized definitions.
top
For the purpose of this subpart:
(a) The term sq m (“sq. ft.”) shall mean the area plated expressed in square meters (square feet).
(b) The term electroless plating shall mean the deposition of conductive material from an autocatalytic plating solution without application of electrical current.
(c) The term operation shall mean any step in the electroless plating process in which a metal is deposited on a basis material and which is followed by a rinse; this includes the related operations of alkaline cleaning, acid pickle, and stripping, when each operation is followed by a rinse.
§§ 413.72-413.73 [Reserved]
top
§ 413.74 Pretreatment standards for existing sources.
top
Except as provided in 40 CFR 403.7 and 403.13, any existing source subject to this subpart which introduces pollutants into a publicly owned treatment works must comply with 40 CFR part 403 and achieve the following pretreatment standards for existing sources (PSES):
(a) No User introducing wastewater pollutants into publicly owned treatment works under the provisions of this subpart shall augment the use of process wastewater or otherwise dilute the wastewater as a partial or total substitute for adequate treatment to achieve compliance with this standard.
(b) For a source discharging less than 38,000 liters (10,000 gal.) per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart G_Electroless Plating Facilities Discharging Less Than 38,000
Liters Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN,A.................................... 5.0 2.7
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
------------------------------------------------------------------------
(c) For plants discharging 38,000 l (10,000 gal) or more per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart G_Electroless Plating Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN,T.................................... 1.9 1.0
Cu...................................... 4.5 2.7
Ni...................................... 4.1 2.6
Cr...................................... 7.0 4.0
Zn...................................... 4.2 2.6
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
Total metals............................ 10.5 6.8
------------------------------------------------------------------------
(d) Alternatively, the following mass-based standards are equivalent to and may apply in place of those limitations specified under paragraph (c) of this section upon prior agreement between a source subject to these standards and the publicly owned treatment works receiving such regulated wastes:
Subpart G_Electroless Plating Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/sq m-operation)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN,T.................................... 74 39
Cu...................................... 176 105
Ni...................................... 160 100
Cr...................................... 273 156
Zn...................................... 164 102
Pb...................................... 23 16
Cd...................................... 47 29
Total metals............................ 410 267
------------------------------------------------------------------------
(e) For wastewater sources regulated under paragraph (c) of this section, the following optional control program may be elected by the source introducing treated process wastewater into a publicly owned treatment works with the concurrence of the control authority. These optional pollutant parameters are not eligible for allowance for removal achieved by the publicly owned treatment works under 40 CFR 403.7. In the absence of strong chelating agents, after reduction of hexavalent chromium wastes, and after neutralization using calcium oxide (or hydroxide) the following limitations shall apply:
Subpart G_Electroless Plating Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN,T.................................... 1.9 1.0
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
TSS..................................... 20.0 13.4
pH...................................... (\1\) (\1\)
------------------------------------------------------------------------
\1\ Within the range 7.5 to 10.00
(f) In addition to paragraphs (a) and (b) of this section, the following limitation shall apply for plants discharging less than 38,000 l (10,000 gal) per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 4.57
------------------------------------------------------------------------
(g) In addition to paragraphs (a), (c), (d), and (e) of this section, the following limitation shall apply for plants discharging 38,000 l (10,000 gal) or more per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 2.13
------------------------------------------------------------------------
(h) In addition to paragraphs (a), (b), (c), (d), (e), (f), and (g) of this section, the following shall apply: An existing source submitting a certification in lieu of monitoring pursuant to §413.03 of this regulation must implement the toxic organic management plan approved by the control authority.
(Secs. 301, 304, 306, 307, 308, and 501 of the Clean Water Act (the Federal Water Pollution Control Act Amendments of 1972, 33 U.S.C. 1251 et. seq., as amended by the Clean Water Act of 1977, Pub. L. 95–217))
[46 FR 9467, Jan. 28, 1981, as amended at 48 FR 32484, July 15, 1983; 48 FR 43681, Sept. 26, 1983]
Subpart H—Printed Circuit Board Subcategory
top
§ 413.80 Applicability: Description of the printed circuit board subcategory.
top
The provisions of this subpart apply to the manufacture of printed circuit boards, including all manufacturing operations required or used to convert an insulating substrate to a finished printed circuit board. The provisions set forth in other subparts of this category are not applicable to the manufacture of printed circuit boards.
§ 413.81 Specialized definitions.
top
For the purpose of this subpart:
(a) The term sq ft (“sq m”) shall mean the area of the printed circuit board immersed in an aqueous process bath.
(b) The term operation shall mean any step in the printed circuit board manufacturing process in which the board is immersed in an aqueous process bath which is followed by a rinse.
§§ 413.82-413.83 [Reserved]
top
§ 413.84 Pretreatment standards for existing sources.
top
Except as provided in 40 CFR 403.7 and 403.13, any existing source subject to this subpart which introduces pollutants into a publicly owned treatment works must comply with 40 CFR part 403 and achieve the following pretreatment standards for existing sources (PSES):
(a) No user introducing wastewater pollutants into a publicly owned treatment works under the provisions of this subpart shall augment the use of process wastewater or otherwise dilute the wastewater as a partial or total substitute for adequate treatment to achieve compliance with this standard.
(b) For a source discharging less than 38,000 liters (10,000 gal) per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart H_Printed Circuit Board Facilities Discharging Less Than 38,000
Liters Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, A................................... 5.0 2.7
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
------------------------------------------------------------------------
(c) For plants discharging 38,000 liters (10,000 gal) or more per calendar day of electroplating process wastewater the following limitations shall apply:
Subpart H_Printed Circuit Board Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 1.9 1.0
Cu...................................... 4.5 2.7
Ni...................................... 4.1 2.6
Cr...................................... 7.0 4.0
Zn...................................... 4.2 2.6
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
Total metals............................ 10.5 6.8
------------------------------------------------------------------------
(d) Alternatively, the following mass-based standards are equivalent to and may apply in place of those limitations specified under paragraph (c) of this section upon prior agreement between a source subject to these standards and the publicly owned treatment works receiving such regulated wastes:
Subpart H_Printed Circuit Board Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/sq m-operation)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 169 89
Cu...................................... 401 241
Ni...................................... 365 229
Cr...................................... 623 357
Zn...................................... 374 232
Pb...................................... 53 36
Cd...................................... 107 65
Total metals............................ 935 609
------------------------------------------------------------------------
(e) For wastewater sources regulated under paragraph (c) of this section, the following optional control program may be elected by the source introducing treated process wastewater into a publicly owned treatment works with the concurrence of the control authority. These optional pollutant parameters are not eligible for allowance for removal achieved by the publicly owned treatment works under 40 CFR 403.7. In the absence of strong chelating agents, after reduction of hexavalent chromium wastes, and after neutralization using calcium oxide (or hydroxide) the following limitations shall apply:
Subpart H_Printed Circuit Board Facilities Discharging 38,000 Liters or
More Per Day PSES Limitations (mg/l)
------------------------------------------------------------------------
Average of
daily values
for 4
Pollutant or pollutant property Maximum for consecutive
any 1 day monitoring
days shall not
exceed
------------------------------------------------------------------------
CN, T................................... 1.9 1.0
Pb...................................... 0.6 0.4
Cd...................................... 1.2 0.7
TSS..................................... 20.0 13.4
pH...................................... (\1\) (\1\)
------------------------------------------------------------------------
\1\ Within the range 7.5 to 10.0
(f) In addition to paragraphs (a) and (b) the following limitation shall apply for plants discharging less than 38,000 l (10,000 gal) per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 4.57
------------------------------------------------------------------------
(g) In addition to paragraphs (a), (c), (d), and (e) the following limitation shall apply for plants discharging 38,000 l (10,000 gal) or more per calendar day of electroplating process wastewater:
------------------------------------------------------------------------
Pollutant or pollutant property Maximum for any 1 day
------------------------------------------------------------------------
Milligrams per liter
(mg/l)
------------------------
TTO............................................ 2.13
------------------------------------------------------------------------
(h) In addition to paragraphs (a), (b), (c), (d), (e), (f), and (g) of this section, the following shall apply: An existing source submitting a certification in lieu of monitoring pursuant to §413.03 of this regulation must implement the toxic organic management plan approved by the control authority.
(Secs. 301, 304, 306, 307, 308, and 501 of the Clean Water Act (the Federal Water Pollution Control Act Amendments of 1972, 33 U.S.C. 1251 et. seq., as amended by the Clean Water Act of 1977, Pub. L. 95–217))
[46 FR 9467, Jan. 28, 1981, as amended at 48 FR 32485, July 15, 1983; 48 FR 43681, Sept. 26, 1983]